半导体领域-晶圆级封装
全自动晶圆级微球植球机(WMB-2000)
( WAFER LEVEL MICRO BALL MOUNTER WMB - 2000 )
通过高精度丝网印刷,微球精准对位搭载,实现晶圆级WLCSP封装工艺。替代了传统晶圆电镀凸点工艺,大幅降低了成本,对应6/8/12英寸晶圆实现了一次性搭载,具有安定化批量生产和高搭载率的优势。
(Through the high-precision screen printing technique, micro ball accurate alignment, realize the wafer level carrying WLCSP encapsulation technology. Significantly raised launch rate, may disposable launch 12-inch wafer of mass production, achieve stability.)

特征:

1.可宽幅对应从80 μm 到450 μm 的微球

2.可对应6/8/12英寸的晶圆

3.自动对位,保证了高精度的植球效果

4.采用简单机构设计,实现了低成本和维护简易化

Features:

1.Ball diameter size is from 80 μmm to 450 μm widely.

2.Be suitable for 6/8/12 inches wafer.

3.The automatic contrapuntal based on image processing, ensure the precision plant ball effect

4.Mechanism design, using simple realize low costs and maintenance facilitation.