半导体领域-BGA/CSP封装
手动BGA植球机
( Manual BALL Attachment machine MBA - 10 )
手动BGA基板植球机MBA-10是通过手动方式对BGA芯片(特别适合陶瓷基板)进行植球的手动设备。
(Manual BALL Attachment machine MBA - 10 is a Manual Attachment Equipment for placing the balls to Ceramic BGA Chip through manual mode of operation. )
 
特征:
1.采用机械定位方式,定位准确可靠,植球成功率高。
2.适应多品种植球;不同品种,只要更换治具即可,操作方便。
3.双刮刀独立自行运行且有压力调节系统,有效的控制刮胶量,保证植球成功率。
Features:
1.Located by mechanical system, the machine is accuracy and reliability with high success rate of ball
attachment.
2.Fit for various of Ceramic Chips. Different jigs for different chips.
3.Mutual independently squeegees can control the quantity of Flux through adjusting the pressure with
ensuring the success rate of ball attachment.