SMT领域-BGA Rework 植球设备
BGA Rework 芯片批量植球机

针对BGA 返修芯片的批量生产特点,制作专用承载台治具,一次放置60-80枚BGA芯片。MBA-1100通过手动方式上下料,自动对BGA承载台中芯片进行植球的自动化设备。
In view of the characteristics of BGA chips rework mass-production, a special support jig is designed to place 60-80 BGA chips. MBA - 1100 is a semi-auto ball attachment equipment for mass production chips on support jig with manual load/unload.
特征
适应BGA Rework芯片的大批量植球。
采用精密机械定位方式,手动上下料,提高了设备的性价比。
通过更换治具,可以最小代价实现品种更换,进行批量生产。
针转印方式涂抹助焊剂。
预埋入方式供球。
Features:
Perfect for BGA Rework mass production ball attachment.
▇Cost-effective equipment with mechanical positioning and manual load/unload.
Changed by jig, low-cost for BGA type changing and mass production.
▇ Pin-transfer method for flux coating.
▇ Pre-buried method for ball supply.
规格书      SPECIFICATIONS
    项目 Items
内容 Contents
最大植球区域
Max. Mounting Area
70W×250L(mm)
锡球直径
Ball Diameter
Ф0.25mm-Ф1.00mm
一次植球数量
Ball Amount
10000
一次植球时间
Mounting Cycle Time
<25s
良率
Yield
99.95%
植球精度
Alignment Accuracy
±0.05(mm)